Evaluation of packages by simulating IC emission using a LECCS model

Author

Takahashi, Ji ; Nakayama, Takeshi ; Saito, Yoshiyuki

Author_Institution

Platform Dev. Center, Matsushita Electr. Industrial Co., Ltd., Osaka

fYear

2006

fDate

Feb. 27 2006-March 3 2006

Firstpage

300

Lastpage

303

Abstract

We applied a LECCS (linear equivalent circuit and current source) model that has been proposed as a model for EMI simulation of an LSI to evaluate package EMI characteristics. We divided the LSI into the chip part and the package part and described it using the LECCS model. We simulated the power supply current spectrum while changing the package part. The measurement results, obtained using the MP (magnetic probe) method, were compared with the simulation results. Our results confirmed that the LECCS model is valid for impact evaluation of the EMI characteristics of a package

Keywords

chip scale packaging; electromagnetic interference; large scale integration; EMI simulation; IC emission; LECCS model; LSI; linear equivalent circuit and current source; magnetic probe method; packages evaluation; power supply current spectrum; Circuit simulation; Current supplies; Electromagnetic interference; Equivalent circuits; Integrated circuit modeling; Integrated circuit packaging; Large scale integration; Power supplies; Probes; Semiconductor device measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 2006. EMC-Zurich 2006. 17th International Zurich Symposium on

Conference_Location

Singapore

Print_ISBN

3-9522990-3-0

Type

conf

DOI

10.1109/EMCZUR.2006.214930

Filename

1629620