Characterization of SSN coupling to signal via in multi-layer PCBs and packages

Author

Park, Jongbae ; Kim, Hyungsoo ; Pak, Jun So ; Kim, Joungho

Author_Institution

Dept. of Electr. Eng. & Comput. Sci., Korea Adv. Inst. of Sci. & Technol., Daejeon

fYear

2006

fDate

Feb. 27 2006-March 3 2006

Firstpage

328

Lastpage

331

Abstract

The signal via is a heavily utilized interconnection structure in high-density system-on-package (SoP) substrates and PCBs. Vias facilitate complicated routings in these multilayer structures. Significant simultaneous switching noise (SSN) coupling occurs through the signal via transition when the signal via suffers return current interruption caused by reference plane exchange. The coupled SSN decreases noise and timing margins of digital and analog circuits, resulting in reduction of achievable jitter performance, bit error ratio (BER) and system reliability. We introduce a modeling method to estimate SSN coupling based on a balanced transmission line matrix (TLM) method. The proposed modeling method is successfully verified by the frequency domain measurements of several via transition structures

Keywords

error statistics; jitter; printed circuits; system-in-package; transmission line matrix methods; BER; SSN coupling; TLM; bit error ratio; high-density system-on-package; jitter; multilayer PCB; signal via; simultaneous switching noise; system reliability; transmission line matrix; Circuit noise; Coupling circuits; Integrated circuit interconnections; Noise reduction; Nonhomogeneous media; Packaging; Routing; Signal to noise ratio; Timing jitter; Transmission line matrix methods;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 2006. EMC-Zurich 2006. 17th International Zurich Symposium on

Conference_Location

Singapore

Print_ISBN

3-9522990-3-0

Type

conf

DOI

10.1109/EMCZUR.2006.214937

Filename

1629627