• DocumentCode
    1907023
  • Title

    Novel Honeycomb SOI Structure with Low Parasitic Capacitance for Human-Sensing Accelerometer

  • Author

    Yokomatsu, T. ; Takeuchi, H. ; Miyagawa, Y. ; Kanda, K. ; Fujita, Takashi ; Higuchi, Kenichi ; Maenaka, Kazusuke

  • fYear
    2012
  • fDate
    5-7 Nov. 2012
  • Firstpage
    70
  • Lastpage
    74
  • Abstract
    To realize extremely low-power consuming sensor systems, a SOHI (Silicon on Honeycomb Insulator) wafer, which has ultra-small parasitic capacitance, is proposed and an accelerometer is fabricated to demonstrate use of the technique. In case of using a low-power-consumption switched capacitor measurement circuit, parasitic capacitance decreases sensor sensitivity dramatically. The concept of the SOHI wafer is a special SOI (Silicon on Insulator) wafer with the buried SiO2 layer replaced with a honeycomb-shaped SiO2 thick layer (20 Ým thick) to reduce the parasitic capacitance. In this paper, two types of SOHI wafer, which could reduce the parasitic capacitance to about 21% and 2% of typical SOI wafers, respectively are proposed. On a trial production, the structure of a prototype three-dimensional accelerometer is fabricated. By demonstrating the application of sensor fabrication, the SOHI wafer is shown as a useable material as the base substrate. Also, the ability to realize the accelerometer with low parasitic capacitance by using the SOHI wafer is demonstrated.
  • Keywords
    accelerometers; capacitance; capacitor switching; elemental semiconductors; honeycomb structures; silicon; silicon compounds; silicon-on-insulator; thin film sensors; 3D human sensing accelerometer; SOHI wafer; Si; SiO2; honeycomb SOI structure; parasitic capacitance; sensor fabrication; silicon on honeycomb insulator; size 20 mum; switched capacitor measurement circuit; Accelerometer; Honeycomb structure; Low parasitic capacitance; Silicon on Insulator;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Emerging Trends in Engineering and Technology (ICETET), 2012 Fifth International Conference on
  • Conference_Location
    Himeji
  • ISSN
    2157-0477
  • Print_ISBN
    978-1-4799-0276-7
  • Type

    conf

  • DOI
    10.1109/ICETET.2012.21
  • Filename
    6495190