• DocumentCode
    1908580
  • Title

    Integration of high performance dual workfunction logic CMOS transistors with a dense 8F/sup 2/ vertical DRAM cell

  • Author

    Rengarajan, R. ; Malik, R. ; Haining Yang ; Yan, W. ; Ramachandran, R. ; Boyong He ; Divakaruni, R. ; Yujun Li

  • Author_Institution
    Infineon Technol., Hopewell Junction, NY, USA
  • fYear
    2002
  • fDate
    11-13 June 2002
  • Firstpage
    58
  • Lastpage
    59
  • Abstract
    In this paper, we report on integration of high performance dual workfunction logic CMOS transistors with a commodity 8F/sup 2/ vertical DRAM cell for high performance stand-alone DRAM and low-cost low-power embedded DRAM applications. Key process integration features that exploit novel aspects of the vertical DRAM cell to enable a high performance embedded DRAM technology are presented. The impact of pre-metal-dielectric reflow thermal budget on dual workfunction CMOS device characteristics is discussed.
  • Keywords
    CMOS memory circuits; DRAM chips; MOSFET; dielectric thin films; integrated circuit interconnections; integrated circuit manufacture; integrated circuit metallisation; work function; dense 8F/sup 2/ vertical DRAM cell; dual workfunction CMOS device characteristics; dual workfunction logic CMOS transistor integration; embedded DRAM technology; low-power embedded DRAM applications; pre-metal-dielectric reflow thermal budget; process integration features; stand-alone DRAM applications; vertical DRAM cell; Boron; CMOS logic circuits; CMOS technology; Doping; Etching; Helium; Logic arrays; Logic gates; Random access memory; Silicon compounds;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, 2002. Digest of Technical Papers. 2002 Symposium on
  • Conference_Location
    Honolulu, HI, USA
  • Print_ISBN
    0-7803-7312-X
  • Type

    conf

  • DOI
    10.1109/VLSIT.2002.1015387
  • Filename
    1015387