Microcrack evaluation for electronics components by AFM nanoDAC deformation measurement

The authors present a new approach to measure displacement and in-plane strain fields utilizing AFM micrographs. The micrographs are captured for different load states of the scanned object. Locally applied correlation algorithms are used to track image pattern and to obtain incremental displacement values. The method has been utilized for microcrack detection and determination of fracture mechanics parameters. A possible procedure to measure stress intensity factors from crack opening displacements nearby the crack tip is demonstrated. It is forseen to use this technique for microcrack and defect evaluation in semiconductor and electronic packaging components