• DocumentCode
    1910573
  • Title

    Miniaturization of thin cantilever-like contacts

  • Author

    Fluss, Harold S.

  • Author_Institution
    AT&T Bell Lab., Whippany, NJ, USA
  • fYear
    1990
  • fDate
    20-23 May 1990
  • Firstpage
    996
  • Abstract
    One consequence of connector miniaturization is the increased sensitivity of the contact normal force to tolerances in geometric and material parameters. This effect is studied for contacts that can be modeled structurally as thin cantilevers, where the tip load corresponds to the normal force. Design curves are developed showing the change in sensitivity as a function of reduction in size for tolerances in length, width, thickness, and Young´s modulus. The complementary problem of determining the reduction in tolerance needed to maintain a given normal force variation as the contact is reduced is also solved. The contact that is stressed into the elastic-plastic regime in the reduced configuration is considered. It is found that, for thin cantilever-like contacts, the sensitivity of normal forces is increased most for tolerances in length, followed by tolerances in thickness. However, since the percentage tolerance in thickness is greater than the tolerance in length for most designs, thickness will likely be the critical parameter in reducing a design. It is also found that to maintain a given normal force range as one scales down, the tolerances allowed have to be reduced by the scaling factor
  • Keywords
    electric connectors; electrical contacts; sensitivity analysis; Young´s modulus; connector miniaturization; constant tolerance; contact normal force; elastic-plastic regime; geometric parameters; material parameters; normal force variation; sensitivity; thin cantilever-like contacts; Closed-form solution; Connectors; Contacts; Dielectrics and electrical insulation; Equations; Inorganic materials; Manufacturing processes; Materials reliability; Process design; Solid modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1990. ., 40th
  • Conference_Location
    Las Vegas, NV
  • Type

    conf

  • DOI
    10.1109/ECTC.1990.122309
  • Filename
    122309