Crosstalk in Substrate Integrated Waveguides: A semi-analytical approach based on side leakage

Substrate Integrated Waveguide, an emerging technology for microwave and mm-wave circuits, merges the advantages of planar manufacturing techniques (e.g. cost, weight, integration) while offering some benefits of tradition all-metal waveguides (e.g. high quality factor). However, a limit to the integration possibilities is posed by the lateral leakage, a typical aspect of Substrate Integrated Waveguide, which causes a crosstalk between adjacent transmission lines. This paper describes a semi-analytical approach, based on the calculation of the side leakage, able to predict the expected crosstalk between two adjacent transmission lines. A comparison with measured results is proposed.