DocumentCode
1911835
Title
Equipment efficiency improvement: the new frontier
Author
Leachman, Robert C. ; Busing, David P. ; Liu, Tmg-Yun ; Moore, David
Author_Institution
California Univ., Berkeley, CA, USA
fYear
1997
fDate
6-8 Oct 1997
Abstract
It has been determined from the Competitive Semiconductor Manufacturing (CSM) Survey that equipment throughput performance is highly divergent among competing fabs, and that even among leaders, there seems to be significant improvement potential. This paper first presents a summary of new research being done at the University of California at Berkeley to measure and monitor OEE and productivity losses. A summary of best practices from the CSM survey is then presented
Keywords
cluster tools; critical path analysis; electronics industry; integrated circuit yield; process control; production control; semiconductor process modelling; OEE; best practices; cluster tools; competitive semiconductor manufacturing survey; equipment efficiency improvement; equipment throughput performance; factory scheduling; idle time; improvement potential; machine availability; on-line efficiency monitoring; process control; production planning; productivity losses; recipe overload; Best practices; Distortion measurement; Lead; Loss measurement; Monitoring; Productivity; Semiconductor device manufacture; Semiconductor process modeling; Throughput; Time measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing Conference Proceedings, 1997 IEEE International Symposium on
Conference_Location
San Francisco, CA
Print_ISBN
0-7803-3752-2
Type
conf
DOI
10.1109/ISSM.1997.664617
Filename
664617
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