DocumentCode
1911868
Title
Datacenter power savings through high ambient datacenter operation: CFD modeling study
Author
Ahuja, Nishi
Author_Institution
Senior Data Center Architect, Intel Corp., USA
fYear
2012
fDate
18-22 March 2012
Firstpage
104
Lastpage
107
Abstract
In a typical datacenter, almost 40% of the total power consumption is spent on datacenter cooling. In addition, the capital expenditure costs for the cooling infrastructure are also significant. Large Internet Portal Datacenters are looking at every possible way to reduce the cooling cost. One of the emerging trends in the industry is to move to higher ambient datacenter operation. Some datacenter operators are even wanting to operate the datacenters at ambient as high as 40C. It is shown that both server power increase and facility level cooling power savings must be considered to determine net power savings at the datacenter level. CFD modeling is used to demonstrate that following best practices in airflow management: using blanking panels, floor layout, eliminating cable obstructions, hot/cold aisle containment and bypass and re-circulation reduction are first important steps to get ready for high ambient datacenter operation. It is shown that without these practices, there is large variation in inlet air temperature from one server to other creating hotspots forcing thermostats on CRAC units to be set low. It is shown that CFD modeling can be used to quantify how cooling path management improves with hot/cold aisle containment. The study shows that significant datacenter level power savings can be achieved by operating the datacenter up to 35C with the use of Economizers.
Keywords
computational fluid dynamics; computer centres; cooling; thermostats; CFD modeling study; CRAC units; airflow management; blanking panels; cable obstructions; capital expenditure costs; cooling cost; cooling infrastructure; cooling path management; datacenter cooling; datacenter level power savings; datacenter operators; datacenter power savings; economizers; facility level cooling power savings; floor layout; high ambient datacenter operation; hot/cold aisle containment; inlet air temperature; large Internet portal datacenters; net power savings; re-circulation reduction; server power; thermostats; total power consumption; Computational fluid dynamics; Computational modeling; Cooling; Layout; Load modeling; Servers; Temperature distribution; Computational Fluid Dynamics; Cooling Control; Cooling Path Management; Data Center; Efficiency; Higher Ambient DC operations (HTA);
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2012 28th Annual IEEE
Conference_Location
San Jose, CA
ISSN
1065-2221
Print_ISBN
978-1-4673-1110-6
Electronic_ISBN
1065-2221
Type
conf
DOI
10.1109/STHERM.2012.6188833
Filename
6188833
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