DocumentCode

1912587

Title

Microelectronic Packaging - Future Trends and Application Challenges

Author

Reichl, H. ; Wolf, J. ; Lang, K.-D.

Author_Institution

Fraunhofer IZM - Berlin, Germany

fYear

1998

fDate

8-10 Sept. 1998

Firstpage

3

Lastpage

7

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Device Research Conference, 1998. Proceeding of the 28th European

Conference_Location

Bordeaux, France

Print_ISBN

2-86332-234-6

Type

conf

Filename

1503478