High performance thermal interface materials with enhanced reliability

Reliability has been a critical issue for thermal interface materials, especially when the materials are used for high power applications. In this paper, a series of reliability tests including baking, humidity chamber, temperature cycling, power cycling, and thermal shock have been conducted. Through comparison with conventional thermal pastes or phase change materials, a novel thermal paste with enhanced reliability is introduced. A mechanistic study has been performed to understand the reason for enhanced reliability. This paste possesses the following features and benefits: (1) Room temperature storage (2) No pump out or dry out (3) Compliable to interfaces (4) Minimal bond strength (5) No need to cure (6) No need to pre-reflow (7) Good tack for component holding (8) Easily printed or dispensed (9) Direct replacement for grease (10) Re-workable This makes it a promising candidate for an advanced thermal dissipation solution in a variety of industrial applications.