• DocumentCode
    1912831
  • Title

    Performance improvements of air-cooled thermal tool with advanced technologies

  • Author

    Mohammed, Rahima K. ; Xia, Yi ; Sahan, Ridvan A. ; Pang, Ying-Feng

  • Author_Institution
    Intel Corp., Santa Clara, CA, USA
  • fYear
    2012
  • fDate
    18-22 March 2012
  • Firstpage
    354
  • Lastpage
    361
  • Abstract
    Air-cooled based thermal margining tool is simple, less costly and reliable cooling solution compared to liquid-cooled thermal tool. Air-cooled thermal tool is used by many Intel® groups for different purposes such as CPU, chipset or ASIC debug and validation. However, conventional air-cooled thermal margining tool do not provide sufficient cooling due to the increasing challenges in thermal management, such as form factor constraint, high power density and noise level limitation. High performance cooling technologies need to be investigated to meet the increasing demand for thermal performance. This paper introduces four advanced cooling strategies, their implementation and ongoing prototyping efforts to achieve performance improvement for air-cooled thermal tool design. In specific, this paper studies the optimization of heat sink design with different fin materials, different embedded heat pipe sizes and numbers, vapor chamber base, liquid chamber base, and combinations of different cooling technologies. The results show that copper fin with liquid chamber base and four φ8mm heat pipes provide the best thermal performance among all the technologies studied.
  • Keywords
    cooling; heat sinks; thermal management (packaging); ASIC debug; CPU; Intel groups; advanced cooling strategies; air-cooled based thermal margining tool; chipset; cooling solution; copper fin; embedded heat pipe sizes; fin materials; form factor constraint; heat sink design; high performance cooling technologies; liquid chamber base; liquid-cooled thermal tool; noise level limitation; power density; thermal management; thermal performance; vapor chamber base; Copper; Heat sinks; Heat transfer; Materials; Resistance heating; Air cooling; heat pipe; high performance thermal technologies; liquid chamber; thermal tool; vapor chamber;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2012 28th Annual IEEE
  • Conference_Location
    San Jose, CA
  • ISSN
    1065-2221
  • Print_ISBN
    978-1-4673-1110-6
  • Electronic_ISBN
    1065-2221
  • Type

    conf

  • DOI
    10.1109/STHERM.2012.6188873
  • Filename
    6188873