• DocumentCode
    1913243
  • Title

    Package design for high-speed low-cost ASIC LSIs

  • Author

    Otsuka, Kanji ; Shirai, Yuji ; Miwa, Takashi ; Nakano, Tetsuo ; Yamagiwa, Akira ; Hatada, Toshio ; Tsuboi, Toshihiro

  • Author_Institution
    Hitachi Ltd., Tokyo, Japan
  • fYear
    1990
  • fDate
    20-23 May 1990
  • Firstpage
    1078
  • Abstract
    Cofired alumina ceramic, alumina-based Cu/polyimide thin films, and plastic PGAs (pin-grid-arrays) are compared in terms of electrical and thermal characteristics and cost. Plastic PGA with the cavity down and a three-layer structure is shown to be the best way to meet the requirement of over 50-MHz signal transmission, thermal resistance and cost. The best results on the 592-pin plastic PGA package and its simulation results are described
  • Keywords
    application specific integrated circuits; ceramics; integrated circuit technology; large scale integration; packaging; polymer films; ASIC LSIs; Al2O3; alumina-based Cu/polyimide thin films; cofired alumina ceramic; cost; electrical characteristics; plastic PGAs; signal transmission; simulation results; thermal characteristics; thermal resistance; Application specific integrated circuits; Copper; Costs; Delay; Electronics packaging; Large scale integration; Pins; Plastic packaging; Thermal resistance; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1990. ., 40th
  • Conference_Location
    Las Vegas, NV
  • Type

    conf

  • DOI
    10.1109/ECTC.1990.122319
  • Filename
    122319
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1913243