DocumentCode
1923820
Title
Low Cost Flip Chip Technology
Author
De Langen, Michael T W
fYear
1997
fDate
16-18 April 1997
Firstpage
67
Lastpage
71
Keywords
Assembly; Costs; Flip chip; Packaging; Personal digital assistants; Printed circuits; Silicon; Soldering equipment; Surface-mount technology; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location
IEEE
Print_ISBN
0-7803-4235-6
Type
conf
Filename
618980
Link To Document