DocumentCode
1923916
Title
Polymer Flip Chip "Process And Reliability Considerations"
Author
Estes, Richard H.
fYear
1997
fDate
16-18 April 1997
Firstpage
92
Lastpage
100
Keywords
Assembly; Bonding; Costs; Flip chip; Integrated circuit interconnections; Manufacturing; Polymers; Semiconductor device packaging; Space technology; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location
IEEE
Print_ISBN
0-7803-4235-6
Type
conf
Filename
618985
Link To Document