Advanced packaging of SiC power module for automotive applications

A novel packaging structure of a power module is developed, which integrates direct liquid cooling for power semiconductor devices through bonding of power stage and a unique cold base plate. By using this technology and combining the attributes of SiC power semiconductor switches, an advanced power module, featuring low power losses and high cooling efficiency, have been produced. Directly compared to a silicon (Si) counterparts and conventional packaging, the advantages of this SiC module packaging in cost-effectiveness, power conversion efficiency, power density for power electronics systems have also been demonstrated.