Analysis of differential vias in a multilayer parallel plate environment using a physics-based CAD model

Author

Abhari, R. ; Eleftheriades, G.V. ; van Deventer-Perkins, E.

Author_Institution

Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada

Volume

3

fYear

2001

fDate

20-24 May 2001

Firstpage

2031

Abstract

A lumped-element physics-based equivalent circuit for differential vias in multilayer parallel plate environments is presented. The TEM parallel plate mode excited by differential vias is quantified by implementing the developed model in a commercial CAD tool. The corresponding CAD simulations are performed in a matter of a few seconds on an Ultra 5 SUN workstation and compare well with Time Domain Reflectometry (TDR) measurements and Finite Difference Time Domain (FDTD) simulations.

Keywords

MMIC; circuit CAD; equivalent circuits; integrated circuit design; integrated circuit interconnections; integrated circuit modelling; lumped parameter networks; MMIC interconnect; TEM mode; Ultra 5 SUN workstation; computer simulation; differential via; lumped element equivalent circuit; multilayer parallel plate environment; physics-based CAD model; Circuit simulation; Equivalent circuits; Finite difference methods; Nonhomogeneous media; Performance evaluation; Reflectometry; Sun; Time domain analysis; Time measurement; Workstations;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 2001 IEEE MTT-S International

Conference_Location

Phoenix, AZ, USA

ISSN

0149-645X

Print_ISBN

0-7803-6538-0

Type

conf

DOI

10.1109/MWSYM.2001.967310

Filename

967310