• DocumentCode
    1931561
  • Title

    A miniaturized lumped-distributed balun for modern wireless communication systems

  • Author

    Ojha, S.P. ; Branner, G.R. ; Kumar, B.P.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., California Univ., Davis, CA, USA
  • Volume
    3
  • fYear
    1996
  • fDate
    18-21 Aug 1996
  • Firstpage
    1347
  • Abstract
    The reduction in size of RF signal processing components is an important part of the miniaturization and cost reduction of wireless communication systems. A balun is a crucial component in most wireless communication systems. In this paper we describe research aimed at reducing the size and manufacturing complexity of printed baluns. A design utilizing distributed microstrip coupled lines and lumped capacitors is presented. The structure has the major advantage of being considerably smaller than the quarter-wavelength size of conventional “planar” baluns. This work is unique in that simulated results are presented which describe the effects and tradeoffs of changing important design parameters. The paper then describes performance-enhancing changes to the design. Excellent response characteristics for coupled circuit performance are shown to result
  • Keywords
    baluns; microstrip couplers; mobile communication; RF signal processing components; cost reduction; coupled circuit performance; design parameters; distributed microstrip coupled lines; lumped capacitors; miniaturized lumped-distributed balun; performance-enhancing changes; printed baluns; response characteristics; wireless communication systems; Arm; Capacitors; Circuit simulation; Couplers; Coupling circuits; Impedance matching; Inductance; Joining processes; Microstrip; Wireless communication;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 1996., IEEE 39th Midwest symposium on
  • Conference_Location
    Ames, IA
  • Print_ISBN
    0-7803-3636-4
  • Type

    conf

  • DOI
    10.1109/MWSCAS.1996.593182
  • Filename
    593182