DocumentCode
1931561
Title
A miniaturized lumped-distributed balun for modern wireless communication systems
Author
Ojha, S.P. ; Branner, G.R. ; Kumar, B.P.
Author_Institution
Dept. of Electr. & Comput. Eng., California Univ., Davis, CA, USA
Volume
3
fYear
1996
fDate
18-21 Aug 1996
Firstpage
1347
Abstract
The reduction in size of RF signal processing components is an important part of the miniaturization and cost reduction of wireless communication systems. A balun is a crucial component in most wireless communication systems. In this paper we describe research aimed at reducing the size and manufacturing complexity of printed baluns. A design utilizing distributed microstrip coupled lines and lumped capacitors is presented. The structure has the major advantage of being considerably smaller than the quarter-wavelength size of conventional “planar” baluns. This work is unique in that simulated results are presented which describe the effects and tradeoffs of changing important design parameters. The paper then describes performance-enhancing changes to the design. Excellent response characteristics for coupled circuit performance are shown to result
Keywords
baluns; microstrip couplers; mobile communication; RF signal processing components; cost reduction; coupled circuit performance; design parameters; distributed microstrip coupled lines; lumped capacitors; miniaturized lumped-distributed balun; performance-enhancing changes; printed baluns; response characteristics; wireless communication systems; Arm; Capacitors; Circuit simulation; Couplers; Coupling circuits; Impedance matching; Inductance; Joining processes; Microstrip; Wireless communication;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems, 1996., IEEE 39th Midwest symposium on
Conference_Location
Ames, IA
Print_ISBN
0-7803-3636-4
Type
conf
DOI
10.1109/MWSCAS.1996.593182
Filename
593182
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