DocumentCode
1931814
Title
Evaluation of surface microroughness for surface activated bonding
Author
Tsukamoto, Kei ; Higurashi, Eiji ; Suga, Tadatomo
Author_Institution
Dept. of Precision Eng., Univ. of Tokyo, Tokyo, Japan
fYear
2010
fDate
24-26 Aug. 2010
Firstpage
1
Lastpage
4
Abstract
In Surface Activated Bonding (SAB), high surface flatness is required for the stability of bonding. Though RMS (Root Mean Square) is often used for the evaluation of surface roughness, RMS is not always enough to express surface roughness appropriately. Therefore, we introduced a numerical method called as Power Spectral Density function to the surfaces of bonding targets. In this research silicon, gold and copper samples are evaluated.
Keywords
density functional theory; integrated circuit packaging; stability; surface roughness; high surface flatness; power spectral density function; root mean square; stability; surface activated bonding; surface microroughness; Optical surface waves; Radiation effects; Rough surfaces; Silicon; Surface roughness; Surface treatment; Surface waves;
fLanguage
English
Publisher
ieee
Conference_Titel
CPMT Symposium Japan, 2010 IEEE
Conference_Location
Tokyo
Print_ISBN
978-1-4244-7593-3
Type
conf
DOI
10.1109/CPMTSYMPJ.2010.5679979
Filename
5679979
Link To Document