DocumentCode
1932716
Title
Designing the thin-film resistors of hybrid integral schemes optimum on warm-up mode
Author
Panichev, Artem V.
Author_Institution
Novosibirsk State Tech. Univ., Russia
fYear
2003
fDate
1-4 July 2003
Firstpage
74
Lastpage
77
Abstract
On the basis of an electrothermal analogy, analytical correlations were determined for the resulting temperature in any spot on a thin-film resistor depending on the desksides of the resistor, diffusing power level and substrate parameters. Conditions were found for the choice of the optimum resistor desksides, ensuring the most even sharing of temperature on its surfaces.
Keywords
hybrid integrated circuits; optimisation; temperature distribution; thermal analysis; thermal diffusion; thermal management (packaging); thin film resistors; electrothermal analogy; even surface temperature sharing; hybrid integral schemes; resistor desksides; thermal diffusion; thin-film resistors; warm-up mode optimized resistors; Ceramics; Electric potential; Joining processes; Mirrors; Resistance heating; Resistors; Substrates; Surface resistance; Temperature dependence; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices and Materials, 2003. Proceedings. 4th Annual 2003 Siberian Russian Workshop on
Print_ISBN
5-7782-0412-4
Type
conf
DOI
10.1109/SREDM.2003.1224189
Filename
1224189
Link To Document