DocumentCode

1934795

Title

C4 Connection Capability Effected By Moisture In Plating Film On C4 Pad

Author

Nakasu, Koichi ; Osakada, Akiyoshi ; Nakano, Sumio

fYear

1997

fDate

16-18 April 1997

Firstpage

326

Lastpage

330

Keywords

Assembly; Atherosclerosis; Ceramics; Electronics packaging; Gold; Heat treatment; Integrated circuit packaging; Moisture; Substrates; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]

Conference_Location

IEEE

Print_ISBN

0-7803-4235-6

Type

conf

Filename

619031