• DocumentCode
    1935001
  • Title

    Simulation analysis of boron pocket deactivation in NMOS transistors with SPER junctions

  • Author

    Aboy, M. ; Pelaz, L. ; Marqués, L.A. ; López, P. ; Santos, I. ; Barbolla, J. ; Duffy, R.

  • Author_Institution
    Departamento de EIectronica, Valladolid Univ., Spain
  • fYear
    2005
  • fDate
    2-4 Feb. 2005
  • Firstpage
    451
  • Lastpage
    454
  • Abstract
    We analyze the effects of junction formation by low-temperature solid phase epitaxial regrowth in NMOS transistors. Atomistic simulations indicate that the high concentration of Si interstitials associated with the end of range (EOR) defects favors the local formation of boron clusters just beyond the amorphous/crystalline interface, in agreement to sheet resistance measurements. Thus, EOR defects locally deactivate B in the NMOS pockets. These boron clusters start dissolution, and thus B reactivates, when the high Si interstitial supersaturation produced by the EOR defects decays close to the equilibrium value. This occurs when EOR defects dissolve or evolve to very stable configurations, such us dislocation loops.
  • Keywords
    MOSFET; boron; dissolving; interstitials; semiconductor junctions; silicon; solid phase epitaxial growth; B; EOR defect; NMOS pockets; NMOS transistors; SPER junctions; Si; Si interstitial; amorphous/crystalline interface; atomistic simulation; boron pocket deactivation; end of range defect; junction formation; low-temperature solid phase epitaxial regrowth; sheet resistance measurement; Amorphous materials; Analytical models; Atomic layer deposition; Atomic measurements; Boron; Crystallization; Electrical resistance measurement; MOS devices; MOSFETs; Solids;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices, 2005 Spanish Conference on
  • Conference_Location
    Tarragona
  • Print_ISBN
    0-7803-8810-0
  • Type

    conf

  • DOI
    10.1109/SCED.2005.1504479
  • Filename
    1504479