DocumentCode
1935001
Title
Simulation analysis of boron pocket deactivation in NMOS transistors with SPER junctions
Author
Aboy, M. ; Pelaz, L. ; Marqués, L.A. ; López, P. ; Santos, I. ; Barbolla, J. ; Duffy, R.
Author_Institution
Departamento de EIectronica, Valladolid Univ., Spain
fYear
2005
fDate
2-4 Feb. 2005
Firstpage
451
Lastpage
454
Abstract
We analyze the effects of junction formation by low-temperature solid phase epitaxial regrowth in NMOS transistors. Atomistic simulations indicate that the high concentration of Si interstitials associated with the end of range (EOR) defects favors the local formation of boron clusters just beyond the amorphous/crystalline interface, in agreement to sheet resistance measurements. Thus, EOR defects locally deactivate B in the NMOS pockets. These boron clusters start dissolution, and thus B reactivates, when the high Si interstitial supersaturation produced by the EOR defects decays close to the equilibrium value. This occurs when EOR defects dissolve or evolve to very stable configurations, such us dislocation loops.
Keywords
MOSFET; boron; dissolving; interstitials; semiconductor junctions; silicon; solid phase epitaxial growth; B; EOR defect; NMOS pockets; NMOS transistors; SPER junctions; Si; Si interstitial; amorphous/crystalline interface; atomistic simulation; boron pocket deactivation; end of range defect; junction formation; low-temperature solid phase epitaxial regrowth; sheet resistance measurement; Amorphous materials; Analytical models; Atomic layer deposition; Atomic measurements; Boron; Crystallization; Electrical resistance measurement; MOS devices; MOSFETs; Solids;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices, 2005 Spanish Conference on
Conference_Location
Tarragona
Print_ISBN
0-7803-8810-0
Type
conf
DOI
10.1109/SCED.2005.1504479
Filename
1504479
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