• DocumentCode
    1935062
  • Title

    GIS modeling with deep pit monitoring data and Corresponding Decision-making Support

  • Author

    Chen Jian ; Sui Mingming

  • Author_Institution
    Coll. of Civil Eng., Nanjing Forestry Univ., Nanjing, China
  • Volume
    5
  • fYear
    2010
  • fDate
    9-11 July 2010
  • Firstpage
    606
  • Lastpage
    609
  • Abstract
    In order to reflect the actual deformation degree and trend of building structure and foundation pit, it was necessary to carry out the deformation measurement of subway construction and information management of construction monitoring. At the present moment, GIS had been applied in many fields but rare in analysis of deformation monitoring data. In this paper, GIS, with powerful capabilities of data analysis and graphics editing, was applied to build model of deep pit monitoring data. Based on GIS modeling, monitoring data visualization and analysis were realized by such as curve drawing of deformation progress, contour lines drawing of deformation region, 3D analysis and deformation thematic maps drawing, etc. Then, the bases of the risk evaluation of subway construction could be provided intuitively and reliably.
  • Keywords
    condition monitoring; data analysis; data visualisation; decision making; decision support systems; deformation; geographic information systems; geotechnical engineering; information management; railway industry; structural engineering computing; 3D analysis; GIS modeling; construction monitoring; contour line drawing; data analysis; data visualization; decision-making support; deep pit monitoring data; deformation thematic map drawing; graphics editing; information management; risk evaluation; subway construction deformation measurement; Deformable models; Monitoring; Solid modeling; Three dimensional displays; Visualization; Decision-making Support; Deep Pit Monitoring; GIS Modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Science and Information Technology (ICCSIT), 2010 3rd IEEE International Conference on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4244-5537-9
  • Type

    conf

  • DOI
    10.1109/ICCSIT.2010.5563864
  • Filename
    5563864