DocumentCode
1935135
Title
Stacked CMOS Technology by Local Overgrowth (LOG)
Author
Zingg, R.P. ; Hofflinger, B. ; Neudeck, G.W.
Author_Institution
Institute for Microelectronics, D-7000 Stuttgart 80, FRG
fYear
1989
fDate
11-14 Sept. 1989
Firstpage
877
Lastpage
880
Abstract
A new process is presented for building stacked CMOS transistors with high device quality. Device deterioration on bulk devices was minimized by reduced temperature processing for the SOI device, and the use of epitaxial lateral overgrowth to produce the silicon film for top devices improved film quality. The application of chemo-mechanical polishing allowed realization of 0.7¿m silicon films with better than 10% uniformity. NMOS transistors built in the bulk material exhibit 700cm2/Vs mobility and 105mV/dec subthreshold slope, while PMOS devices in the SOI film have surface mobilities of 165cm2Vs and a subthreshold slope of 109mV/dec. Threshold voltages are 0.5V and - 1.5V, respectively.
Keywords
CMOS process; CMOS technology; Circuits; Dielectric substrates; Dielectrics and electrical insulation; Epitaxial growth; MOS devices; Semiconductor films; Silicon on insulator technology; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Device Research Conference, 1989. ESSDERC '89. 19th European
Conference_Location
Berlin, Germany
Print_ISBN
0387510001
Type
conf
Filename
5436465
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