• DocumentCode
    1935135
  • Title

    Stacked CMOS Technology by Local Overgrowth (LOG)

  • Author

    Zingg, R.P. ; Hofflinger, B. ; Neudeck, G.W.

  • Author_Institution
    Institute for Microelectronics, D-7000 Stuttgart 80, FRG
  • fYear
    1989
  • fDate
    11-14 Sept. 1989
  • Firstpage
    877
  • Lastpage
    880
  • Abstract
    A new process is presented for building stacked CMOS transistors with high device quality. Device deterioration on bulk devices was minimized by reduced temperature processing for the SOI device, and the use of epitaxial lateral overgrowth to produce the silicon film for top devices improved film quality. The application of chemo-mechanical polishing allowed realization of 0.7¿m silicon films with better than 10% uniformity. NMOS transistors built in the bulk material exhibit 700cm2/Vs mobility and 105mV/dec subthreshold slope, while PMOS devices in the SOI film have surface mobilities of 165cm2Vs and a subthreshold slope of 109mV/dec. Threshold voltages are 0.5V and - 1.5V, respectively.
  • Keywords
    CMOS process; CMOS technology; Circuits; Dielectric substrates; Dielectrics and electrical insulation; Epitaxial growth; MOS devices; Semiconductor films; Silicon on insulator technology; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Device Research Conference, 1989. ESSDERC '89. 19th European
  • Conference_Location
    Berlin, Germany
  • Print_ISBN
    0387510001
  • Type

    conf

  • Filename
    5436465