• DocumentCode
    1936397
  • Title

    AlSi/Ti/AlSi Multisandwich Systems on TiN/Ti for VLSI Interconnect Applications

  • Author

    Roska, G. ; Kucher, P. ; Vollmer, B. ; Oppolzer, H. ; Zorn, G. ; Cichy, H.

  • Author_Institution
    Siemens AG, Semiconductor Division, Otto-Hahn-Ring 6, D-8000 Mÿnchen 83, F.R.G.
  • fYear
    1989
  • fDate
    11-14 Sept. 1989
  • Firstpage
    657
  • Lastpage
    660
  • Abstract
    The influence of the Ti thickness of the AlSi/Ti/AlSi system on Ti/TiN was investigated by transmission electron microscopy (TEM), x-ray diffraction measurements, scanning electron microscopy (SEM) and energy dispersive x-ray analysis (EDX). The results are discussed and correlated to the data of accelerated electromigration stress tests.
  • Keywords
    Dispersion; Electromigration; Energy measurement; Life estimation; Scanning electron microscopy; Thickness measurement; Tin; Transmission electron microscopy; Very large scale integration; X-ray diffraction;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Device Research Conference, 1989. ESSDERC '89. 19th European
  • Conference_Location
    Berlin, Germany
  • Print_ISBN
    0387510001
  • Type

    conf

  • Filename
    5436519
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1936397