DocumentCode
1936439
Title
The application of e beam inspection on 3D NAND flash
Author
Liao, Hsiang-Chou ; Chen, Yi-Chin ; Lee, Guan-Ru ; Shih, Yen-Hao ; Lue, Hang-Ting ; Luoh, Tuung ; Yang, Ling-Wu ; Hsieh, Kuang-Yeu ; Yang, Tahone ; Chen, Kuang-Chao ; Liu, Rich ; Lu, Chih-Yuan
Author_Institution
Technol. Dev. Center, Macronix Int. Co. Ltd., Hsinchu, Taiwan
fYear
2012
fDate
4-4 Sept. 2012
Firstpage
1
Lastpage
2
Abstract
Various three-dimensional (3D) multilayer stacks NAND flash architectures are developed by several companies, the defect performance monitoring under such complicated architectures has become a new challenge in 3D NAND flash. The aim of this paper is to illustrate e beam inspection system can monitor the tiny, invisible defects and electrical defects that can not be recognized by optical systems.
Keywords
electron beam applications; flash memories; inspection; semiconductor device manufacture; 3D NAND flash; e-beam inspection; electrical defect; electronic beam inspection; invisible defect; multilayer stacks NAND flash; optical system; tiny defect; Bridge circuits; Bridges; Flash memory; Inspection; Monitoring; Nonhomogeneous media; Very large scale integration; 3D NAND; Defect inspection; Vertical-Gate; Voltage Contrast; e Beam Inspection;
fLanguage
English
Publisher
ieee
Conference_Titel
e-Manufacturing & Design Collaboration Symposium (eMDC), 2012
Conference_Location
HsinChu
Print_ISBN
978-1-4673-4540-8
Type
conf
DOI
10.1109/eMDC.2012.6338433
Filename
6338433
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