• DocumentCode
    1937413
  • Title

    Development of RF/microwave on-chip inductors using an organic micromachining process

  • Author

    Ramachandran, R. ; Newlin, D. ; Pham, A.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Clemson Univ., SC, USA
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    97
  • Lastpage
    100
  • Abstract
    Presents the design and development of on-chip inductors using an organic micromachining process for RF and microwave applications. The process employs an SU-8 negative photoresist for developing micromachined structures using standard lithography techniques and is compatible with post-IC process to integrate passive devices onto foundry-fabricated circuits. Our initial results demonstrate that a spiral inductor fabricated on Si using this technology achieves a measured Q-factor of 20 at 2.1 GHz. Further refinement of the process and design will increase the Q-factor to 60 as predicted by electromagnetic simulations. At the meeting we will present the design and development of various inductor topologies, including gridded ground planes, for achieving high Q-factors
  • Keywords
    MMIC; Q-factor; UHF integrated circuits; elemental semiconductors; inductors; micromachining; photoresists; silicon; 2.1 GHz; Q-factor; RF applications; SU-8 negative photoresist; Si; electromagnetic simulations; foundry-fabricated circuits; gridded ground planes; inductor topologies; microwave applications; on-chip inductors; organic micromachining process; post-IC process; spiral inductor; standard lithography techniques; Circuits; Inductors; Lithography; Micromachining; Microwave devices; Q factor; Radio frequency; Resists; Spirals; Standards development;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2001
  • Conference_Location
    Cambridge, MA
  • Print_ISBN
    0-7803-7024-4
  • Type

    conf

  • DOI
    10.1109/EPEP.2001.967620
  • Filename
    967620