Measurement of RF properties of glob top and under-encapsulant materials

Author

Li, Li ; Cook, Ben ; Veatch, Mark

Author_Institution

Interconnect Syst. Lab., Motorola Inc., Tempe, AZ, USA

fYear

2001

fDate

2001

Firstpage

121

Lastpage

124

Abstract

In this paper we introduce an improved RF dielectric measurement technique based on the Agilent 4291A Impedance Analyzer and 16453A Dielectric Material Test Fixture covering frequencies ranging from 1 MHz to 1 GHz. The measurement structure is a simple parallel plate capacitor with the material under test serving as the dielectric. Obtaining consistent data requires careful sample preparation and accurate alignment between the 16453A electrodes. We describe our procedures for creating flat, polished, metallized samples starting with encapsulant samples in their liquid form. Data for a variety of encapsulants are shown. The technique is readily extendable to solid materials, and we include data for selected samples of LTCC substrates as well as a MAPBGA molding compound

Keywords

dielectric measurement; encapsulation; moulding; specimen preparation; substrates; 1 MHz to 1 GHz; 16453A Dielectric Material Test Fixture; Agilent 4291A Impedance Analyzer; LTCC substrate; MAPBGA molding compound; RF properties; dielectric measurement; glob top material; liquid encapsulant; parallel plate capacitor; sample alignment; sample preparation; solid material; under-encapsulant material; Capacitors; Dielectric materials; Dielectric measurements; Electrodes; Fixtures; Impedance; Materials testing; Metallization; Radio frequency; Solids;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2001

Conference_Location

Cambridge, MA

Print_ISBN

0-7803-7024-4

Type

conf

DOI

10.1109/EPEP.2001.967626

Filename

967626