Modeling of multi-vias coupling for high speed interconnects

Author

Huang, Chung-Chi ; Tsang, Leung ; Miller, Dennis ; Tripathi, Alok

Author_Institution

Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA

fYear

2001

fDate

2001

Firstpage

161

Lastpage

164

Abstract

Modeling of multiple via coupling is an important problem in the design of high-speed interconnect systems. It is known that the inter-via coupling has non-negligible effects on the signal integrity of high-speed circuits. In this paper, we investigate first order multi-via coupling based on a two-coupled-vias model. Analytical results are compared with experimental data up to 5GHz. Transient waveforms were obtained for reflection and transmission for trapezoidal and Gaussian input

Keywords

Gaussian distribution; circuit layout CAD; high-speed integrated circuits; integrated circuit interconnections; printed circuit layout; transient analysis; waveform analysis; 0 to 5 GHz; Gaussian input; high speed interconnects; high-speed circuits; inter-via coupling; multi-vias coupling; signal integrity; transient waveforms; trapezoidal input; two-coupled-vias model; Circuit synthesis; Coupling circuits; Electromagnetic scattering; Equations; Frequency; Integrated circuit interconnections; Joining processes; Reflection; Scattering parameters; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2001

Conference_Location

Cambridge, MA

Print_ISBN

0-7803-7024-4

Type

conf

DOI

10.1109/EPEP.2001.967636

Filename

967636