DocumentCode
1938452
Title
Modeling and measurement of the Alpha 21364 package
Author
Tsuk, Michael ; Dame, Roger ; Dvorscak, Daniel ; Houghton, Chris ; Laurent, Jim St
Author_Institution
Compaq Comput. Corp., Marlborough, MA, USA
fYear
2001
fDate
2001
Firstpage
283
Lastpage
286
Abstract
The latest generation Alpha microprocessor, the 21364, uses a ceramic LGA package with mesh power and ground planes. Electromagnetic modeling and measurements were used to verify the validity of the design of the package, and to suggest improvements to the layout to minimize crosstalk
Keywords
ceramic packaging; crosstalk; electromagnetic fields; integrated circuit layout; integrated circuit measurement; integrated circuit packaging; microprocessor chips; power supply circuits; Alpha 21364 microprocessor package; Alpha microprocessor; ceramic LGA package; crosstalk minimization; electromagnetic modeling; measurement; mesh ground planes; mesh power planes; modeling; package design validity verification; package layout; Capacitance; Crosstalk; Electromagnetic measurements; Electromagnetic modeling; Inductance; Mesh generation; Microprocessors; Packaging; Power generation; SPICE;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2001
Conference_Location
Cambridge, MA
Print_ISBN
0-7803-7024-4
Type
conf
DOI
10.1109/EPEP.2001.967664
Filename
967664
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