Package model extraction from multi-port S-parameters

Author

Andrews, James A. ; Kabir, Sutirtha

fYear

2001

fDate

2001

Firstpage

309

Lastpage

312

Abstract

This paper proposes a procedure for extracting package models from multi-port S-parameters. By utilizing all the elements in an n×n S-parameter matrix, the proposed deterministic procedure provides a better starting point for S-parameter optimization when compared with underdetermined extraction procedures based on multiple 2-port S-matrices using EIA/JEDEC Standard 123. An efficient procedure is discussed for generating a ladder model consisting of an arbitrary number of identical sections

Keywords

S-parameters; circuit analysis computing; circuit optimisation; equivalent circuits; integrated circuit modelling; integrated circuit packaging; lumped parameter networks; standards; EIA/JEDEC Standard 123; S-parameter matrix elements; S-parameter optimization; deterministic procedure; equivalent circuit; ladder model; lumped element circuit; multi-port S-parameters; multiple two-port S-matrices; package model extraction; package models; underdetermined extraction procedures; Admittance; Circuits; Data mining; Equations; Frequency; Graphical user interfaces; Mathematical model; Packaging; Scattering parameters; Transmission line matrix methods;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2001

Conference_Location

Cambridge, MA

Print_ISBN

0-7803-7024-4

Type

conf

DOI

10.1109/EPEP.2001.967670

Filename

967670