• DocumentCode
    1940275
  • Title

    Spatial and thermal measurements using thermography CCD during HF soldering of metallic tubes

  • Author

    Renier, E. ; Suzeau, P. ; Truchetet, F. ; Geveaux, P.

  • Author_Institution
    Univ. of Burgundy, Le Creusot, France
  • Volume
    3
  • fYear
    1998
  • fDate
    31 Aug-4 Sep 1998
  • Firstpage
    1699
  • Abstract
    High frequency soldering allows high production speed, contactless heating and good quality of the weld. The speed limit of soldering is principally imposed by a good drive of the metal in the profiling machine. To control a HF soldering process, the authors propose a new method and approach which consists in controlling the temperature with a thermal image acquisition system developed in their laboratory. Their computer vision, described in this paper, is based on CCD thermography. This technology brings many advantages and tools in the measurement of thermal and spatial parameters. In fact, high spatial (800×600 pixels) and temporal resolutions, good relative thermal resolution (10°C in the range of 800 to 2000°C), linearity of calibration curves and large temperature measurement range are the main advantages of their system. They especially developed some specific image processing (line subpixel detection) used to measure spatial parameters: soldering angle, tube axis, shift between borders of the metal sheet along transversal cross section. All these parameters controlled in real time, allow to inform the welder operator about process drift. Actually, this machine is used to control the process and not to supervise it. Some information measured during HF soldering help them to analyse and understand all the occurring process drift
  • Keywords
    CCD image sensors; computer vision; process control; soldering; spatial variables control; spatial variables measurement; temperature control; temperature measurement; 800 to 1000 C; CCD thermography; HF soldering; calibration curves; computer vision; metallic tubes; perature measurement range; process drift; profiling machine; soldering process control; spatial measurements; thermal image acquisition system; thermal measurements; Charge coupled devices; Control systems; Frequency measurement; Hafnium; Production; Soldering; Spatial resolution; Temperature control; Velocity measurement; Welding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics Society, 1998. IECON '98. Proceedings of the 24th Annual Conference of the IEEE
  • Conference_Location
    Aachen
  • Print_ISBN
    0-7803-4503-7
  • Type

    conf

  • DOI
    10.1109/IECON.1998.722930
  • Filename
    722930