DocumentCode
1942775
Title
Dopant Redistribution from Ion Implanted WSi2 on Poly-Si
Author
Nygren, S ; Levy, D. ; Goltz, G ; Torres, J.
Author_Institution
C.N.E.T/C.N.S., Chemin du Vieux Chêne, BP 98, F-38243 Meylan, France; Royal institute of Technology, Solid State Electronics, S-10044 Stockholm, Sweden
fYear
1987
fDate
14-17 Sept. 1987
Firstpage
483
Lastpage
486
Abstract
The possibility of doping the polycrystalline silicon in a polycide configuration by implantation into the silicide and subsequent thermal diffusion has been evaluated. In a first step it is demonstrated that a phosphorus implantation to a dose of 5E15 cm-2 into WSi2 can produce flatband voltages similar to those obtained by conventional diffusion doping into the polysilicon. This is true even if 2E15 cm¿2 boron is subsequently implanted. Secondly arsenic and boron implantations were tried with the aim to produce n-and p-doped gates respectively. Work function shifts between the two species approaching 1 Vindicate that typical source/drain implantations may be used for this purpose.
Keywords
Annealing; Boron; CMOS technology; Conductivity; Doping; Geometry; Silicides; Silicon; Very large scale integration; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Device Research Conference, 1987. ESSDERC '87. 17th European
Conference_Location
Bologna, Italy
Print_ISBN
0444704779
Type
conf
Filename
5436823
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