• DocumentCode
    1942775
  • Title

    Dopant Redistribution from Ion Implanted WSi2 on Poly-Si

  • Author

    Nygren, S ; Levy, D. ; Goltz, G ; Torres, J.

  • Author_Institution
    C.N.E.T/C.N.S., Chemin du Vieux Chêne, BP 98, F-38243 Meylan, France; Royal institute of Technology, Solid State Electronics, S-10044 Stockholm, Sweden
  • fYear
    1987
  • fDate
    14-17 Sept. 1987
  • Firstpage
    483
  • Lastpage
    486
  • Abstract
    The possibility of doping the polycrystalline silicon in a polycide configuration by implantation into the silicide and subsequent thermal diffusion has been evaluated. In a first step it is demonstrated that a phosphorus implantation to a dose of 5E15 cm-2 into WSi2 can produce flatband voltages similar to those obtained by conventional diffusion doping into the polysilicon. This is true even if 2E15 cm¿2 boron is subsequently implanted. Secondly arsenic and boron implantations were tried with the aim to produce n-and p-doped gates respectively. Work function shifts between the two species approaching 1 Vindicate that typical source/drain implantations may be used for this purpose.
  • Keywords
    Annealing; Boron; CMOS technology; Conductivity; Doping; Geometry; Silicides; Silicon; Very large scale integration; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Device Research Conference, 1987. ESSDERC '87. 17th European
  • Conference_Location
    Bologna, Italy
  • Print_ISBN
    0444704779
  • Type

    conf

  • Filename
    5436823