• DocumentCode
    1945660
  • Title

    A wafer-integrated array of micromachined electrostatically-driven ultrasonic resonators for microfluidic applications

  • Author

    Parviz, B.A. ; Chou, T.-K. ; Zhang, C. ; Najafi, K. ; Muller, M.O. ; Bernal, Luis P. ; Washabaugh, P.

  • Author_Institution
    Center for Integrated MicroSyst., Michigan Univ., Ann Arbor, MI, USA
  • fYear
    2000
  • fDate
    23-27 Jan 2000
  • Firstpage
    34
  • Lastpage
    39
  • Abstract
    A distributed micromachined ultrasound source is presented. Electrostatic actuators operating at frequencies exceeding 100 kHz are coupled to a Helmholtz resonator in order to achieve high output velocities. They consist of a 1200 μm×1200 μm×1.36 μm composite diaphragm, a perforated P++ backplate and a 3 μm air gap. The actuators cover the entire surface of a 4" wafer and are grouped in four individually addressable quadrants. A robust micromachining technology with >80% yield, employing anodic glass-silicon bonding, dissolved wafer process and advanced deep silicon etching has been developed for fabrication of the actuator array. The dynamic behavior of the diaphragm was studied using laser interferometry, and operation was verified at 96 kHz by acoustic measurement
  • Keywords
    acoustic radiators; acoustic resonators; acoustic streaming; diaphragms; electrostatic actuators; microfluidics; micromachining; micromechanical resonators; sputter etching; ultrasonic arrays; wafer bonding; 1.36 micron; 1200 micron; 96 kHz; Helmholtz resonator; Si; advanced deep silicon etching; air gap; anodic glass-silicon bonding; array fabrication; composite diaphragm; dissolved wafer process; distributed micromachined ultrasound source; dynamic behavior; electrostatic actuators; electrostatically-driven ultrasonic resonators; flow models; high output velocity; individually addressable quadrants; laser interferometry; microfluidic applications; perforated P++ backplate; robust micromachining technology; wafer-integrated array; Electrostatic actuators; Etching; Frequency; Interferometry; Micromachining; Optical device fabrication; Robustness; Silicon; Ultrasonic imaging; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2000. MEMS 2000. The Thirteenth Annual International Conference on
  • Conference_Location
    Miyazaki
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-5273-4
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2000.838486
  • Filename
    838486