• DocumentCode
    1945890
  • Title

    System performance comparisons of coreless and standard packages for data rate beyond 20 Gbps

  • Author

    Beyene, Wendemagegnehu T. ; Schmitt, Ralf ; Shi, Hao ; Feng, June

  • Author_Institution
    Rambus Inc., Los Altos, CA
  • fYear
    2008
  • fDate
    27-30 May 2008
  • Firstpage
    526
  • Lastpage
    532
  • Abstract
    This paper analyzes the impact of standard and coreless packages on the overall high-speed system performance for data rate beyond 20 Gbps. Instead of focusing on package electrical performance in isolation, we study the package impact on the system performance metrics such as voltage and timing margins and bit error rate (BER) bathtub curves in both time and voltage by employing statistical system simulation methods. Furthermore, the package impact on the quality of the power supply network is also studied using conventional frequency and time domain simulation techniques. Finally, three designs with standard and coreless packages are analyzed to compare the package impacts on signal integrity and power integrity of high-speed systems.
  • Keywords
    error statistics; frequency-domain analysis; power supply quality; time-domain analysis; BER; bit error rate; coreless packages; frequency domain simulation techniques; high-speed system performance; package electrical performance; power integrity; power supply network quality; signal integrity; statistical system simulation methods; system performance comparisons; time domain simulation techniques; voltage-timing margins; Bit error rate; Electronics packaging; Frequency; Impedance; Performance analysis; Signal analysis; System performance; Timing; Variable structure systems; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4244-2230-2
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2008.4550023
  • Filename
    4550023