DocumentCode
1945890
Title
System performance comparisons of coreless and standard packages for data rate beyond 20 Gbps
Author
Beyene, Wendemagegnehu T. ; Schmitt, Ralf ; Shi, Hao ; Feng, June
Author_Institution
Rambus Inc., Los Altos, CA
fYear
2008
fDate
27-30 May 2008
Firstpage
526
Lastpage
532
Abstract
This paper analyzes the impact of standard and coreless packages on the overall high-speed system performance for data rate beyond 20 Gbps. Instead of focusing on package electrical performance in isolation, we study the package impact on the system performance metrics such as voltage and timing margins and bit error rate (BER) bathtub curves in both time and voltage by employing statistical system simulation methods. Furthermore, the package impact on the quality of the power supply network is also studied using conventional frequency and time domain simulation techniques. Finally, three designs with standard and coreless packages are analyzed to compare the package impacts on signal integrity and power integrity of high-speed systems.
Keywords
error statistics; frequency-domain analysis; power supply quality; time-domain analysis; BER; bit error rate; coreless packages; frequency domain simulation techniques; high-speed system performance; package electrical performance; power integrity; power supply network quality; signal integrity; statistical system simulation methods; system performance comparisons; time domain simulation techniques; voltage-timing margins; Bit error rate; Electronics packaging; Frequency; Impedance; Performance analysis; Signal analysis; System performance; Timing; Variable structure systems; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
978-1-4244-2230-2
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2008.4550023
Filename
4550023
Link To Document