Microrelay packaging technology using flip-chip assembly

Using flip-chip assembly, micromachined connectors can be used to create a high density, actuatable electronics packaging technology. Internal residual stress is used to press bimorph beam connectors upwards against a device chip. Deformation can be increased by introducing stress through a heat treating process. The effects of heat treatment are more prominent on larger devices and are long lasting in nature. The connectors´ actuation behavior is described, including appropriate mathematical models. The electrostatically actuated beams will disconnect when driven by a 53 volt signal and will reconnect when voltage falls below 43 volts. When switching signals, reconnection occurs in as little as 5.8 μs, disconnection occurs in as little as 4.0 μs. A microconnector´s current carrying capability can be as high as 285.3 mA and its maximum power dissipation as high as 1.47 W