DocumentCode
1947877
Title
Peridynamic theory for impact damage prediction and propagation in electronic packages due to drop
Author
Agwai, Abigail ; Guven, Ibrahim ; Madenci, Erdogan
Author_Institution
Aerosp. & Mech. Eng. Dept., Univ. of Arizona, Tucson, AZ
fYear
2008
fDate
27-30 May 2008
Firstpage
1048
Lastpage
1053
Abstract
In this study, peridynamic theory is used to investigate dynamic response of electronic packages subjected to impact loading arising from drop-shock. First, the theory is briefly described, followed by validation against a fundamental dynamic fracture problem. Finally, peridynamic theory was demonstrated by considering a drop test experiment.
Keywords
dynamic response; electronics packaging; fracture; impact (mechanical); drop test; drop-shock; dynamic fracture; dynamic response; electronic package; impact damage prediction; impact damage propagation; impact loading; peridynamic theory; Acceleration; Aerodynamics; Capacitive sensors; Condition monitoring; Electronics packaging; Failure analysis; Finite element methods; Performance evaluation; Soldering; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
978-1-4244-2230-2
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2008.4550105
Filename
4550105
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