• DocumentCode
    1948185
  • Title

    CABET: Connectivity-based boundary extraction of large-scale 3D sensor networks

  • Author

    Jiang, Hongbo ; Zhang, Shengkai ; Tan, Guang ; Wang, Chonggang

  • Author_Institution
    Dept. of Electron. & Inf. Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China
  • fYear
    2011
  • fDate
    10-15 April 2011
  • Firstpage
    784
  • Lastpage
    792
  • Abstract
    Sensor networks are invariably coupled tightly with the geometric environment in which the sensor nodes are deployed. Network boundary is one of the key features that characterize such environments. While significant advances have been made for 2D cases, so far boundary extraction for 3D sensor networks has not been thoroughly studied. We present CABET, a novel Connectivity-bAsed Boundary Extraction scheme for large-scale Three-dimensional sensor networks. To the best of our knowledge, CABET is the first 3D-capable and pure connectivity-based solution for detecting sensor network boundaries. It is fully distributed. A highlight of CABET is its non-uniform critical node sampling, called r r´-sampling, that selects landmarks to form boundary surfaces with bias toward nodes embodying salient topological features. Simulations show that CABET is able to extract a well-connected boundary in the presence of holes and shape variation, with performance superior to that of some state-of-the-art alternatives. In addition, we show how CABET benefits a range of sensor network applications including 3D skeleton extraction and 3D segmentation.
  • Keywords
    wireless sensor networks; 3D segmentation; 3D skeleton extraction; CABET; connectivity-based boundary extraction scheme; hole variation; large-scale 3D sensor network; nonuniform critical node sampling; salient topological feature; shape variation; Feature extraction; Image edge detection; Joining processes; Nickel; Shape; Surface reconstruction; Three dimensional displays;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    INFOCOM, 2011 Proceedings IEEE
  • Conference_Location
    Shanghai
  • ISSN
    0743-166X
  • Print_ISBN
    978-1-4244-9919-9
  • Type

    conf

  • DOI
    10.1109/INFCOM.2011.5935300
  • Filename
    5935300