Effect of board and package attributes on solder joint reliability of FCBGA packages based on IPC9701 characterization

Author

Radhakrishnan, Jagadeesh

Author_Institution

Intel Corp., Folsom, CA

fYear

2008

fDate

27-30 May 2008

Firstpage

1431

Lastpage

1437

Abstract

The purpose of this document is to present the results of a study to compare the long term solder joint reliability between flip chip ball grid array packages, FCBGA, using eutectic solder balls (63Sn37Pb) and lead free SAC405 solder balls (95.5Sn4.0Ag0.5Cu) under accelerated thermal loading conditions. It draws its conclusions from results obtained from accelerated temperature cycle testing data based on the IPC9701 standard, performance test methods and qualification requirements for surface mount solder attachments. Under similar testing conditions, the results of the study show that (a) lead free solder joints perform better than eutectic solder joints, (b), thermal enabling solutions improve the reliability, and (c) thicker boards reduce the solder joint reliability.

Keywords

ball grid arrays; flip-chip devices; semiconductor device reliability; solders; thermal management (packaging); FCBGA package; IPC9701 standard; eutectic solder balls; flip chip ball grid array package; lead free SAC405 solder balls; solder joint reliability; thermal loading; Acceleration; Electronics packaging; Environmentally friendly manufacturing techniques; Flip chip; Lead; Life estimation; Soldering; Temperature; Testing; Thermal loading;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2008. ECTC 2008. 58th

Conference_Location

Lake Buena Vista, FL

ISSN

0569-5503

Print_ISBN

978-1-4244-2230-2

Electronic_ISBN

0569-5503

Type

conf

DOI

10.1109/ECTC.2008.4550165

Filename

4550165