• DocumentCode
    1952066
  • Title

    High-frequency effects of Al-lossy lines in MCM-D on silicon substrate

  • Author

    Gospodinova, Mika ; Arnaudov, Rumen ; Mollov, Valentin S. ; Philippov, Philip

  • Author_Institution
    Dept. of Microelectron., Tech. Univ. Sofia, Bulgaria
  • Volume
    2
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    751
  • Abstract
    This paper discusses an experimental investigation of the behavior of high-speed Si/SiO2/Al based microstrip, when an extra DC bias voltage is applied to the line. In order to reduce the insertion losses caused by the semiconductor substrate, we suggest a superposition of a DC biasing to the high-speed signal applied to the line. This way, the conductor line changes the surface properties of the semiconductor substrate. To provide the characterization of this effect a number of test structures containing a variety of microstrip asymmetric transmission lines were prepared. The obtained results suggest a way of controlling the performance and energy propagation of interconnects on semiconductor substrates. The studied effect can be successfully applied in high-speed blocks with tuning parameters
  • Keywords
    MOS capacitors; S-parameters; aluminium; interconnections; losses; microstrip lines; multichip modules; silicon; silicon compounds; Al-lossy lines; MCM-D on silicon substrate; MOS lossy line; Si-SiO2-Al; Si/SiO2/Al based microstrip; distributed RLCG model; energy propagation; extra DC bias voltage; high-frequency effects; high-speed microstrip; insertion losses; interconnects on semiconductor substrate; microstrip asymmetric transmission lines; tuning parameters; Capacitance; Conductors; Insertion loss; Microstrip; Propagation losses; Quantum computing; Semiconductor materials; Silicon; Substrates; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics, 2000. Proceedings. 2000 22nd International Conference on
  • Conference_Location
    Nis
  • Print_ISBN
    0-7803-5235-1
  • Type

    conf

  • DOI
    10.1109/ICMEL.2000.838799
  • Filename
    838799