• DocumentCode
    1952503
  • Title

    Conductive lithographic films

  • Author

    Ramsey, B.J. ; Evans, P.S.A. ; Harrison, D.

  • Author_Institution
    Dept. of Design, Brunel Univ., Egham, UK
  • fYear
    1997
  • fDate
    5-7 May 1997
  • Firstpage
    252
  • Lastpage
    256
  • Abstract
    This paper reports progress in the development of a novel fabrication technique for printing circuit board designs directly onto suitable substrates. Circuit tracks can be formed on organic or synthetic substrates by depositing films of a metal-loaded ink via a standard lithographic printing process. The application of this work is in substitutes for conventional (copper-clad resin/laminate) circuit boards where, for low complexity circuits, directly printed substrates offer cost advantages and environmental benefits. The paper is a resume of work and results, including; ink formulation, environmental test, circuit modelling and life cycle analysis. Conductive lithographic films have now been successfully demonstrated in a telephone handset developed in conjunction with Nortel, microprocessor and microwave stripline applications. Whilst developed primarily as a low cost, low environmental impact alternative to subtractive PCB manufacture, other potential advantages such as flexibility and environmental robustness are apparent
  • Keywords
    environmental testing; life testing; photolithography; printed circuit manufacture; thin films; PCB designs; circuit modelling; conductive lithographic films; directly printed substrates; environmental benefits; environmental test; fabrication technique; ink formulation; life cycle analysis; lithographic printing process; metal-loaded ink; organic substrates; printing circuit boards; synthetic substrates; Circuit testing; Conductive films; Costs; Fabrication; Ink; Laminates; Printed circuits; Printing; Resins; Resumes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics and the Environment, 1997. ISEE-1997., Proceedings of the 1997 IEEE International Symposium on
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-7803-3808-1
  • Type

    conf

  • DOI
    10.1109/ISEE.1997.605330
  • Filename
    605330