DocumentCode
1952565
Title
Establishment of the mesoscale parameters for epoxy-copper interfacial separation
Author
Wong, C.K.Y. ; Leung, S.Y.Y. ; Poelma, R.H. ; Jansen, K.M.B. ; Yuan, C.C.A. ; van Driel, W.D. ; Zhang, G.Q.
Author_Institution
Dept. PME, Delft Univ. of Technol., Delft, Netherlands
fYear
2012
fDate
16-18 April 2012
Firstpage
42375
Lastpage
42527
Abstract
Mesoscale parameters, which describe the atomic interactions of the polymer-metal interface at the separation process, are important in the development of a coarse grain model for the interfacial adhesion study. A non-equilibrium molecular dynamics model is established to obtain the traction-displacement relations of the separation of epoxy-copper interfaces. We study three influencing parameters of the relations including dynamics time, displacement increment and model sizes. It illustrates that the displacement rate as related to the dynamics time has to be above a critical value to ensure the separation. The model has been benchmarked by comparing the deduced interaction energy with the thermodynamics work of adhesion reported in literature. An analytical scheme to discern the mesoscale parameters (the interaction energy and the equilibrium distance) from the relations is discussed. The proposed methodology contributes to the multiscale model development of interfacial separation.
Keywords
adhesion; adhesive bonding; copper; electronics packaging; molecular dynamics method; resins; atomic interaction; coarse grain model; displacement increment; displacement rate; dynamics time; epoxy-copper interface; epoxy-copper interfacial separation; equilibrium distance; interaction energy; interfacial adhesion; mesoscale parameter; nonequilibrium molecular dynamics model; polymer-metal interface; thermodynamics; traction-displacement relation; Annealing; Argon; Gold; Heating; Reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on
Conference_Location
Cascais
Print_ISBN
978-1-4673-1512-8
Type
conf
DOI
10.1109/ESimE.2012.6191737
Filename
6191737
Link To Document