DocumentCode
1952607
Title
Monitoring of thermal ablation therapy based on shear modulus changes: Shear wave thermometry and shear wave lesion imaging
Author
Arnal, Bastien ; Pernot, Mathieu ; Tanter, Mickael
Author_Institution
Inst. Langevin, Univ. Paris 7, Paris, France
fYear
2010
fDate
11-14 Oct. 2010
Firstpage
1522
Lastpage
1525
Abstract
The use of High intensity Focused Ultrasound (HIFU) for non invasive therapy requires improving real-time monitoring of the lesion formation during treatment, to avoid damage of the surrounding healthy tissues. The goal of this study is to show the feasibility of a full ultrasound approach that relies on the real-time and quantitative assessment of the changes in tissue elasticity both to map temperature and monitor the lesion formation. HIFU treatment and monitoring was performed using a confocal set made up of a 8MHz ultrasound diagnostic probe (Vermon) and a 2.5MHz single element transducer focused at 30mm (Imasonic) on ex-vivo samples. US-temperature estimation based on speckle tracking was combined with Supersonic Shear Wave Imaging (SWI) on the same device (Aixplorer, SuperSonic Imagine). The SWI sequence consisted in successive shear waves induced at different lateral positions. The shear wave propagation was acquired at 17000 frames/s, from which the elasticity map was recovered. HIFU sonications were interleaved with fast imaging acquisitions allowing a duty cycle of more than 90%. A low-temperature elevation calibration phase is performed using a dedicated sequence just before the actual treatment. A full elasticity and temperature mapping was achieved every 3 seconds during the treatment. Below 40°C, tissue stiffness was found to reversibly decrease with temperature at the focal zone (-0.86kPa/°C). US-temperature was highly correlated to stiffness variation maps (correlation coefficient: 0.91-0.97). The linear dependence of elasticity changes below 50°C enables to perform thermometry imaging directly from elasticity changes maps. Then, for higher temperatures, lesion formation induced a very strong increase of the elastic modulus in the focal zone. Thus, the same method allowed a complete follow-up of the tissue during treatment in two particular regimes: shear wave thermometry during heating and shear wave lesion imaging when the - - thermal threshold was reached. Shear wave temperature imaging allows temperature to be estimated up to 50°C. Moreover, SWT was shown to be very low sensitive to motion (for tissue motion less than 2 cm/s) allowing temperature estimation on moving area. Finally, the size of the thermal lesions determined on the stiffness maps correlated strongly with optical contrast of tissue cuts (+/-0.15mm). Shear Wave Thermometry is a novel reliable approach for ultrasound based monitoring of thermal ablation. SWT can be combined with shear wave lesion imaging to achieve a complete follow up of the treatment.
Keywords
biomechanics; biomedical transducers; biomedical ultrasonics; elastic waves; elasticity; image sequences; medical image processing; patient monitoring; shear modulus; thermometers; ultrasonic focusing; ultrasonic therapy; ultrasonic transducers; Aixplorer; HIFU sonications; Imasonic transducer; SWI sequence; SuperSonic Imagine; Vermon; elastic modulus; ex-vivo samples; frequency 2.5 MHz; frequency 8 MHz; high-intensity focused ultrasound; imaging acquisitions; lesion formation; low-temperature elevation calibration phase; noninvasive therapy; optical contrast; real-time monitoring; shear modulus; shear wave lesion imaging; shear wave propagation; shear wave thermometry; single element transducer; speckle tracking; stiffness; supersonic shear wave imaging; temperature 50 degC; temperature mapping; thermal ablation; thermal ablation therapy; thermal threshold; tissue elasticity; tissue motion; ultrasound diagnostic probe; Acoustics; Estimation; Imaging; Lesions; Temperature dependence; Temperature measurement; Ultrasonic imaging; HIFU; elastography; rf ablation; thermometry;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium (IUS), 2010 IEEE
Conference_Location
San Diego, CA
ISSN
1948-5719
Print_ISBN
978-1-4577-0382-9
Type
conf
DOI
10.1109/ULTSYM.2010.5935503
Filename
5935503
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