• DocumentCode
    1953120
  • Title

    Lamp with rigid LED strip - Design and thermal management

  • Author

    Mashkov, Petko ; Pencheva, Tamara ; Gyoch, Berkant

  • Author_Institution
    Phys. Dept., Univ. of Rousse, Rousse, Bulgaria
  • fYear
    2011
  • fDate
    11-15 May 2011
  • Firstpage
    39
  • Lastpage
    44
  • Abstract
    Investigations are connected with design and application of thermally and cost effective rigid LED strips. Standard FR 4 PCB is used for making rigid strip and LEDs are soldered on it. Special copper pins soldered underneath LEDs contribute to low thermal resistance between LEDs and heat sink - like when MCPCBs are used. Application of this type low cost rigid LED strips allows decreasing operations (and expenses) connected with assembling of LEDs onto a heat sink several times. A lamp for interior lighting is designed on the base of this type LED strips. Thermal management calculations are made and proper heat sink is chosen. Thermal loading of LEDs is experimentally tested at various ambient conditions (air temperatures from 20°C to 45°C) and different current values through LEDs - up to 600 mA. Infrared thermography is used for evaluation of temperature distribution on LEDs and heat sink. Thermal management investigations show very good qualities of developed LED strips.
  • Keywords
    LED lamps; assembling; heat sinks; infrared imaging; soldering; temperature distribution; thermal management (packaging); FR 4 PCB; LED assembly; LED strips; MCPCB; ambient conditions; copper pins; decreasing operations; heat sink; infrared thermography; interior lighting; lamp; low thermal resistance; rigid LED strip; rigid strip; soldering; temperature distribution evaluation; thermal loading; thermal management calculations; thermal management investigations; Copper; Heat sinks; Junctions; Light emitting diodes; Strips; Temperature measurement; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology (ISSE), 2011 34th International Spring Seminar on
  • Conference_Location
    Tratanska Lomnica
  • ISSN
    2161-2528
  • Print_ISBN
    978-1-4577-2111-3
  • Type

    conf

  • DOI
    10.1109/ISSE.2011.6053546
  • Filename
    6053546