• DocumentCode
    1953239
  • Title

    Modeling and fabrication of Pt micro-heaters built on alumina Substrate

  • Author

    Toskov, Sasa ; Glatz, Ronald ; Miskovic, G. ; Radosavljevic, G.

  • Author_Institution
    Inst. of Sensor & Actuator Syst., Vienna Univ. of Technol., Vienna, Austria
  • fYear
    2013
  • fDate
    8-12 May 2013
  • Firstpage
    47
  • Lastpage
    52
  • Abstract
    This paper presents design, simulation, fabrication and experimental characterization of the platinum micro-heater elements built on alumina substrate. Micro-heaters are designed for application where the device has to be heated up to 700 °C in less than a 200 ms. Choosing the proper combination of electrical, thermal and mechanical characteristics of thick film heating resistor, glass layer and substrate, as well as geometrical parameters of heating element is crucial for proper heat transfer and performance of the device. These parameters have been taken into account during predetermination of the micro-heaters behavior by means of finite element analyses (FEA) using COMSOL 4.2. Preliminary experimental tests have been conducted in stationary regime using InfraTec ImageIR 8300 thermography system. Simulation and experimental results are compared in order to prove capability of FEA for the design process.
  • Keywords
    alumina; finite element analysis; heating elements; platinum; resistors; thick films; COMSOL 4.2; FEA; InfraTec ImageIR 8300 thermography system; Pt; alumina substrate; design process; electrical characteristics; finite element analyses; geometrical parameters; glass layer; heat transfer; mechanical characteristics; platinum microheater element modelling; thermal characteristics; thick film heating resistor; Finite element analysis; Glass; Heating; Power demand; Resistors; Substrates; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology (ISSE), 2013 36th International Spring Seminar on
  • Conference_Location
    Alba Iulia
  • ISSN
    2161-2528
  • Type

    conf

  • DOI
    10.1109/ISSE.2013.6648213
  • Filename
    6648213