Measurements of water contact angle on FR4 and polyimide substrates relating electrochemical migration

Author

Medgyes, Balint ; Illes, Balazs ; Gal, Laszlo

Author_Institution

Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Budapest, Hungary

fYear

2013

fDate

8-12 May 2013

Firstpage

157

Lastpage

160

Abstract

Contact angle measurements of water droplets were carried out on fiberglass epoxy resin and polyimide substrates related to water condensation effect as an antecedent process of electrochemical migration. It was shown in our previous paper that water condensation intensity depends mainly on the surface roughness (which determines capillary condensation) and on the heat diffusivity of the substrate material as well. However, not only water condensation intensity has a high impact on electrochemical migration but also the water wettability of the surface. The wettability of the different substrates was estimated by the contact angle calculation using the drop shape method. The results correspond to the surface roughness and heat diffusivity differences of the substrates, thus the time to failure values.

Keywords

condensation; contact angle; drops; electrochemistry; electromigration; surface roughness; water; wetting; FR4 substrate; H₂O; antecedent process; drop shape method; electrochemical migration; fiberglass epoxy resin substrate; heat diffusivity; polyimide substrate; surface roughness; water condensation intensity; water contact angle measurements; water droplets; water wettability; Electronic countermeasures; Liquids; Rough surfaces; Shape; Solids; Substrates; Surface roughness;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Technology (ISSE), 2013 36th International Spring Seminar on

Conference_Location

Alba Iulia

ISSN

2161-2528

Type

conf

DOI

10.1109/ISSE.2013.6648234

Filename

6648234