• DocumentCode
    1954169
  • Title

    Studies on the transitional behaviors of Au-to-Au micro-contact during the initialization stage of contact formation under low contact force

  • Author

    Qiu, Haodong ; Wang, Hong ; Ke, Feixiang

  • Author_Institution
    Microelectron. Centre, Nanyang Technol. Univ., Singapore, Singapore
  • fYear
    2012
  • fDate
    16-18 April 2012
  • Firstpage
    42374
  • Lastpage
    42495
  • Abstract
    In nowadays, ohmic-contact MEMS switches have been widely studied due to their variously advantages, such as high isolation, low insertion loss, negligible power consumption and so on. The micro-contact behavior has been analyzed by several researchers using the conventional asperity deformation model, in which the electrical contact resistance decreases gradually with increasing contact force and finally reaches a saturation region. This paper presents a study of the instable region of micro-contact behaviors under low contact force and low current conditions, where the conventional model does not seems to be applicable. Random telegraph signals (RTS) were captured during the transition period before the establishment of stable electrical contact. An electrothermal approach was applied in our work and the time constants of the RTS during instable region are extracted statistically from the experimental data. The fundamental mechanism for the contact resistance instabilities were discussed under the framework of material transfer enhanced by localized Joule heating.
  • Keywords
    contact resistance; microswitches; asperity deformation model; contact force; contact formation; contact resistance instability; electrical contact resistance; insertion loss; localized Joule heating; material transfer; microcontact behavior; negligible power consumption; ohmic-contact MEMS switches; random telegraph signal; saturation region; stable electrical contact; transitional behaviors; Micromechanical devices; Microwave technology; Packaging; Switches;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on
  • Conference_Location
    Cascais
  • Print_ISBN
    978-1-4673-1512-8
  • Type

    conf

  • DOI
    10.1109/ESimE.2012.6191804
  • Filename
    6191804