Polymer-based 2D/3D wafer level heterogeneous integration for SSL module

Author

Yuan, Cadmus ; Wei, Jia ; Ye, Huaiyu ; Koh, Sau ; Harianto, S. ; Van den Nieuwenhof, Monique ; Zhang, G.Q.

Author_Institution

TNO, Eindhoven, Netherlands

fYear

2012

fDate

16-18 April 2012

Firstpage

42376

Lastpage

42558

Abstract

This paper demonstrates a heterogeneous integration of solid state lighting (SSL) module, including light source (LED) and driver/control components. Such integration has been realized by the polymer-based reconfigured wafer level package technologies and such structure has been prototyped and tested. The structure design, thermal design consideration, material selection & process technologies, and mechanical challenges will be also described in this paper.

Keywords

light emitting diodes; light sources; polymers; wafer level packaging; 2D/3D wafer level heterogeneous integration; LED; SSL module; driver/control components; light source; polymer; solid state lighting module; wafer level package technologies; Artificial intelligence; Assembly; Atmospheric modeling; Light emitting diodes; Phosphors; Silicon; Solid state lighting; Wafer level packaging; polymer based package; reconfigured wafer;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on

Conference_Location

Cascais

Print_ISBN

978-1-4673-1512-8

Type

conf

DOI

10.1109/ESimE.2012.6191808

Filename

6191808