DocumentCode
1956244
Title
Building a sustainable future for silicon photonics
Author
Baets, Roel
Author_Institution
INTEC-Dept., Ghent Univ., Ghent, Belgium
fYear
2011
fDate
14-16 Sept. 2011
Firstpage
3
Lastpage
4
Abstract
Silicon photonics presents immense opportunity for innovation in telecom, datacom and sensing. But how do we build the food chain from research to high volume manufacturing? How do we address the issues associated with design tools, industrial fab capability, test and packaging capability?
Keywords
elemental semiconductors; integrated optics; packaging; silicon; Si; datacom; immense opportunity; industrial fab capability; packaging; sensing; silicon photonics; sustainable future; telecom; volume manufacturing; Companies; Integrated circuit modeling; Manufacturing; Packaging; Photonics; Silicon; Transceivers;
fLanguage
English
Publisher
ieee
Conference_Titel
Group IV Photonics (GFP), 2011 8th IEEE International Conference on
Conference_Location
London
ISSN
1949-2081
Print_ISBN
978-1-4244-8338-9
Type
conf
DOI
10.1109/GROUP4.2011.6053696
Filename
6053696
Link To Document