DocumentCode
1957047
Title
Effect of contamination on copper migration in TAB tape structures
Author
Nieman, D.A.
Author_Institution
Intel Corp., Chandler, AZ, USA
fYear
1994
fDate
11-14 April 1994
Firstpage
87
Lastpage
92
Abstract
Copper migration in adhesive of Tape Automated Bonding (TAB) tape during biased moisture stress can cause failure. Experiments aimed at reducing copper migration show that copper precipitation lengths after HAST are linearly proportional to chloride concentration in the TAB tape material. Discharge potential measurements of TAB tape in 156 /spl deg/C bake are correlated to chloride concentration.<>
Keywords
circuit reliability; failure analysis; integrated circuit testing; tape automated bonding; 156 degC; HAST; TAB tape structures; adhesive; biased moisture stress; chloride concentration; copper migration; discharge potential measurements; precipitation lengths; Clamps; Conducting materials; Conductors; Contamination; Copper; Packaging; Performance evaluation; Plastics; Stress; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1994. 32nd Annual Proceedings., IEEE International
Conference_Location
San Jose, CA, USA
Print_ISBN
0-7803-1357-7
Type
conf
DOI
10.1109/RELPHY.1994.307852
Filename
307852
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